Specifications

• Model: 5909, CHA Solutions.
• Vacuum Chamber: Type: Water cooled stainless steel, Size: 18\"D x 18\"W x 24\"H & Source distance: 15\".
• Systems Control Options: Manual: Autotech sequencer & PLC: Siemens touch screen.
• Vapor Source Options: Electron beam gun: 4 x 15cc & Resistance source.
• Pumping Options: Cryo & Mechanical.
• Ultimate Vacuum: System 10^-9^ Torr & Chamber 10^-8^ Torr.

Principles

The CHA Solution is a high vacuum Physical Vapor Deposition System that is used to create high-quality thin films of oxides, metals, and semiconductors. The system has two sources for evaporation: e-beam and resistance source. One mechanical pump is installed for rough pumping and one cryo pump for high vacuum pumping. The turret can accommodate four crucibles at a time to allow multiple and sequential evaporations. Substrates are held in a rotating dome. The deposition controller allows for automatically controlled rise and soaks of crucible melts, and tightly controlled deposition of films.

Capabilities

• Vacuum down to 10^-8^ Torr.
• 4 15cc pockets for different materials.
• Suitable for 4 inch wafers and smaller samples.
• Programmable and controllable deposition process.
• Different beam sweeping shapes.
• Manual/Auto deposition mode.
• 6 sample holders.
• Resistance source.

Applications

• Thin film deposition.
• Material Science.
• Lift-off processes.
• Contact Metallization.
• Micro/Nano fabrication.